IC Diamond 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity.

Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.

Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.

Key Features

• Each tube of IC Diamond Thermal grease contains 24carats of micronized diamond with diamond particle loadings @ 94% by weight. Material loading above 90% is recommended as the best combination of rheological and thermal properties to minimize interface pump out due to thermal cycling.
• Superior bulk conductivity
• Excellent thermal impedance
• Tight particle distributions
• < 40 µ maximum particle diameter
• Silicone free
• Lower viscosity
• Greater stability
• Non capacitive or electrically conductive

Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use. *

Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use.

Key Specifications:

Thermal Conductance: 4.5 W/m-K (data acquired with an ASTM D - 5470 thermal interface test instrument)
Thermal Resistance: 0.25oC-cm2/W@ 100 µ BLT
Average Particle Size: <40 µ maximum particle diameter
Compliancy: RoHS Compliant.

* Note Cure Time Assumes an optimized pressure of 50  PSI Lighter load pressures will increase cure times to a week or more